時間：2019-12-05 瀏覽次數(shù)：885次
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設備名稱: |
Laser Dicing M/C |
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廠家: |
ACCRETECH |
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型號: |
ML300Plus ⅡWH |
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年份: |
now |
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設備狀態(tài): |
new |
12-inch laser dicing machine with wafer handling system.
We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.
